LED Module

ABSTRACT

A light emitting diode (“LED”) module with improved thermal characteristics is provided. The module includes an LED, a first circuit board, a second circuit board, a lower insulator, an upper insulator, a lower contact, upper contacts, and a heat sink. Preferably, the heat sink comprises an outer housing and a contact ring. The LED and the heat sink are attached to the first circuit board via solder. In addition to serving as a substrate for the LED, the first circuit board (which contains a plurality of thermally conductive layers connected by vias) facilitates the transfer of heat away from the LED to the heat sink. The module also has improved mechanical and electrical properties, including redundant electrical connections, stable mechanical connections, and a shock-absorbing lower contact. The lower insulator can also be configured to prevent misalignment of the power source with the lower contact when the module is used in a flashlight or other lighting device.

CROSS-REFERENCE TO RELATED APPLICATION

The application is a continuation of application Ser. No. 14/704,279,filed May 5, 2015 which is a continuation application of Ser. No.12/188,201, filed Aug. 7, 2008, now U.S. Pat. No. 9,022,612 issued May5, 2015, the contents of which are incorporated by reference as if fullyset forth herein.

FIELD OF THE INVENTION

The field of the present invention relates to a light emitting diode(“LED”) module, and pertains particularly to an LED module for use inhand-held and other portable lighting devices, such as flashlights andheadlamps.

BACKGROUND OF THE INVENTION

LEDs have been used in various applications, including illuminatingwatches, transmitting information from remote controls, and formingimages on jumbo television screens. More recently, LEDs have been usedin portable lighting devices (such as flashlights and headlamps)because, among other things, LEDs can last longer, produce light moreefficiently, and be more durable than incandescent lamps commonly usedin conventional flashlights and headlamps.

However, the brightness and expected life of an LED typically decreaseswith increased temperature. Effective dissipation of heat is thereforeneeded to maintain the temperature of the LED within its design limits.

Further, a limitation on many LED modules is the medium used to affixthe LED to its supporting substrate. Current LED modules use a thermalepoxy or other similar substance. Thermal epoxies are difficult to workwith and require extended cure times. LED attachments using thermalepoxies also have an increased incidence of premature failure.

Another limitation on many LED modules, especially those intended foruse in flashlights and other portable lighting devices, is theirinability to prevent operation of the lighting device when the powersource (e.g., one or more batteries) are incorrectly aligned.

A further limitation on known LED modules, such as described in UnitedStates Patent Publication 2007/0058366 A1 (published Mar. 15, 2007), hasbeen their relative complexity of assembly or manufacture.

Finally, another limitation on many LED modules used in portablelighting devices is their susceptibility to failure caused by electricalinterruptions and/or shock from outside forces.

In view of the foregoing limitations on current LED modules, an objectof the present invention is to provide an improved LED module that atleast partially ameliorates one or more of the foregoing problems in theart.

SUMMARY OF THE INVENTION

To the above end, in a preferred embodiment, the LED module is providedcomprising an LED, a first circuit board, a lower assembly formed by alower contact and a lower insulator, a second circuit board, an upperassembly formed by an upper insulator and upper contacts, and a heatsink formed by an outer housing and a contact ring. The LED and the heatsink are affixed to the first circuit board, preferably via a solderconnection. The first circuit board, which has a plurality of thermallyconductive layers connected by thermal vias, promotes the rapid andefficient transfer of heat from the LED to the heat sink.

In the preferred embodiment, the LED module also provides for a bondbetween the LED and the first circuit board, as well as bond between thefirst circuit board and the heat sink, that exhibit improved thermal,electrical, and mechanical characteristics, and that are lesssusceptible to premature failure.

In the preferred embodiment, the LED module also provides for protectionagainst incorrect insertion or alignment of the power source thatsupplies energy to the LED, as well as improved mechanical stability andshock resistance to outside forces.

In the preferred embodiment, the LED module also provides for redundancyin the channels of electrical communication between components, therebyrendering the module less susceptible to failure from electricalinterruptions.

In the preferred embodiment, the LED module also provides for animproved assembly that tolerates larger mechanical tolerances, thateliminates cure times, and that has increased flexibility in theorientation of its constituent components.

Further aspects, objects, desirable features, and advantages of the LEDmodule will be better understood from the following description,considered in connection with the accompanying drawings in which thepreferred embodiment of the LED module is illustrated by way of example.It is to be expressly understood, however, that the drawings are for thepurpose of illustration only and are not intended as a definition of thelimits of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of the LED module.

FIG. 2 is a side view of the LED module.

FIG. 3 is an exploded view showing the components of the LED moduleprior to assembly.

FIG. 4 is a longitudinal cross-sectional view of the LED module of FIG.1, as seen along the plane 4-4 in FIG. 1.

FIG. 5 is a longitudinal cross-sectional view of the LED module of FIG.1, as seen along the plane 5-5 in FIG. 1.

FIG. 6 is a perspective view of the first circuit board of FIG. 3.

FIG. 7 is a bottom view of the first circuit board of FIG. 3.

FIG. 8 is a multi-plane cross-sectional view of the first circuit board,LED, and contact ring.

FIG. 9 is a perspective view of the contact ring of FIG. 3.

FIG. 10 is a perspective view of the lower contact of FIG. 3.

FIG. 11 is a perspective view of the lower insulator of FIG. 3.

FIG. 12 is a top view of the lower insulator of FIG. 3.

FIG. 13 is a bottom view of the lower insulator and the lower contact.

FIG. 14 is a perspective view of the second circuit board of FIG. 3.

FIG. 15 is a side view of the second circuit board of FIG. 3.

FIG. 16 is a perspective view of the upper assembly of FIG. 3.

FIG. 17 is a side view of the upper assembly of FIG. 3.

FIG. 18 is a top view of the upper assembly of FIG. 3.

FIG. 19 is a cross-sectional view of a flashlight equipped with an LEDmodule having features in accordance with the present invention.

FIG. 20 is an enlarged cross-sectional view of a flashlight equippedwith an LED module having features in accordance with the presentinvention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

An LED module 10, according to a preferred embodiment, is shown in FIGS.1-5. In the illustrated embodiment, the LED module 10 includes an LED20, a first circuit board 30, a lower assembly 55 formed by a lowercontact 50 and a lower insulator 60, a second circuit board 70, an upperassembly 85 formed by an upper insulator 80 and upper contacts 90, 91,and a heat sink 101 formed by an outer housing 100, preferably made ofmetal, and a contact ring 40.

The LED 20 can be any light emitting diode that can be soldered to aprinted circuit board. Preferably the LED 20 can be soldered to thefirst circuit board 30 using a screen applied solder paste and a reflowoven. More preferably, the LED 20 is the LUXEON® Rebel productcommercially available from Philips Lumileds Lighting Company, LLC. TheLED 20 has an upper surface 200 and a lower surface 210. The uppersurface 200 has a diode 220 that is capable of emitting visible light ina direction away from the upper surface 200. The lower surface 210 has apositive contact and a negative contact (not shown) that are inelectrical communication with the diode 220 in a conventional manner.The lower surface 210 also has a heat pad (not shown) that is in thermalcommunication with the diode 220.

FIGS. 6-8 illustrate one embodiment of the first circuit board 30. Inthe present embodiment, the first circuit board 30 is generally circularin shape. The first circuit board 30 has an upper surface 300 and alower surface 305. The first circuit board 30 is preferably about 5/16″in diameter, less than 1/16″ in thickness, and is preferably formed froma metal clad printed circuit board. The first circuit board 30 servesthree primary functions. First, it functions as a substrate forsupporting the LED 20. Second, it functions as a thermal conductor fortransferring heat away from the LED 20 to the contact ring 40 of heatsink 101. Third, it functions as part of the electrical circuit of theflashlight. In particular, one conductor of the first circuit board 30electrically connects one terminal, preferably the positive terminal, ofthe LED 20 to the lower contact 50 via upper contact 91 and the secondcircuit board 70, and a second conductor of the first circuit board 30electrically connects a second terminal of LED 20, preferably thenegative terminal, to the outer housing 100 via contact ring 40.

As shown in FIG. 6, the upper surface 300 is defined, in part, by anon-electrically conducting substrate 310. Further, in the preferredembodiment, the upper surface 300 includes a relatively small andrectangular shaped positive terminal 315, a relatively small andrectangular shaped negative terminal 320, and a relatively large andrectangular shaped thermal pad 325. Other pad shapes are possible.

The upper surface 300 also includes first and second generally “L”shaped landings 330, 335 located about the periphery near the outer edge340 of the first circuit board 30. The first landing 330, which occupiesjust under half of the periphery, has a wide region 345 and a narrowregion 350. The second landing 335, which also occupies just under halfof the periphery, also has a wide region 355 and a narrow region 360.The wide regions 345, 355 are located opposite each other. Similarly,the narrow regions 350, 360 are located opposite each other. Both thefirst and the second landings 330, 335 are in electrical communicationwith the negative terminal 320 and the thermal pad 325. The positiveterminal 315 is electrically isolated from the remainder of the uppersurface 300.

As shown in FIG. 7, the lower surface 305 is also defined, in part, by anon-electrically conducting substrate 365. Further, the lower surface305 includes, in the preferred embodiment, a rectangular shaped positiveterminal 370. The positive terminal 370 is positioned near the center ofthe lower surface 305, with its longitudinal axis aligned in the samedirection as the longitudinal axis of the thermal pad 325 on the uppersurface 300. No portion of the positive terminal 370 reaches the outeredge 340 of the first circuit board 30.

The lower surface 305 also includes two additional pad areas. The firstis a generally “C” shaped negative terminal 375, which occupies justunder half of the periphery, near the outer edge 340. The second isanother generally “C” shaped negative terminal 380, which also occupiesjust under half of the periphery, near the outer edge 340. The portionsof the non-electrically conducting substrate 365 on the lower surface305 that extend to the outer edge 340 are located below the wide regions345, 355 of the generally “L” shaped landings 330, 335 on the uppersurface 300.

The lower surface 210 of the LED 20 is attached to the upper surface 300of the first circuit board 30 by a screen applied solder paste, which isthen sent through a reflow oven. The lower surface 210 of the LED 20 isoriented relative to the upper surface 300 of the first circuit board 30so that the heat pad of the LED 20 is positioned above the thermal pad325, the positive contact of the LED 20 is positioned above the positiveterminal 315, and the negative contact of the LED 20 is positioned abovethe negative terminal 320. The positive contact on the lower surface 210of the LED 20 is therefore in electrical communication with the positiveterminal 315 on the upper surface 300 of the first circuit board 30, andthe negative contact on the lower surface 210 of the LED 20 is inelectrical communication with the negative terminal 320 on the uppersurface 300 of the first circuit board 30. Further, the diode 220 on theupper surface 200 of the LED 20 is in thermal communication with thethermal pad 325 on the upper surface 300 of the first circuit board 30via the heat pad on the lower surface 210 of the LED 20.

The use of a screen applied solder paste, instead of a thermal epoxy orother similar material, to attach the LED 20 to the first circuit board30 increases the efficiency of the heat transfer between thesestructures. It also simplifies and increases the speed of the assemblyprocess by eliminating the need to work with adhesive substances andcure times. Further, the strength of the solder connection reduces thelikelihood of premature failure of this attachment, given the tendencyof thermal epoxy to become brittle over time.

As shown in FIG. 8, the first circuit board 30 preferably includesmultiple parallel layers of a thermally conductive material, preferablya metal such as copper. More preferably, these layers contain 4 ouncecopper. The first circuit board 30, preferably, has four such layers385-388. Blind thermal vias 390, 395 thermally connect all but thelowermost copper content layer 388. A plurality of these blind vias 390are located in the vicinity of the thermal pad 325. These blind vias 390draw heat away from the diode 220, through the thermal pad 325, and intothe high copper content layers 385-387. A plurality of the blind thermalvias 395 are also located in the vicinity of the first and secondlandings 330, 335, with particular focus on the wide regions 345, 355thereof. The blind vias 395 draw heat out of the high copper contentlayers 385-387 and into the first and second landings 330, 335.

The first circuit board 30 also includes electrical through vias 397,398 that connect all of the copper content layers 385-387. At least oneelectrical through via 397 connects the positive terminal 315 on theupper surface 300 with the positive terminal 370 on the lower surface305. Further, at least one electrical through via 398 connects thenegative terminal 320 on the upper surface 300 with each of the negativeterminals 375 & 380 on the lower surface 305.

The first circuit board 30 may also include alignment holes 399 that runfrom the upper surface 300, through the entire thickness of the board,to the lower surface 305. These alignment holes 399 are preferablylocated on the periphery of the first circuit board 30 between the firstand second landings 330, 335, and may be used to align the first circuitboard 30 relative to the upper insulator 80 and upper contacts 90, 91.

FIG. 9 illustrates the contact ring 40 of the preferred embodiment. Thecontact ring 40 forms part of the heat sink 101 in the presentembodiment. The contact ring 40 is generally oval shaped with an oblongcentral cavity 400 and a raised main body 405 having an upper surface410 and a lower surface 415. The main body 405 comprises a first wideportion 420, a second wide portion 425 (opposite the width of thecentral cavity 400 from the first wide portion 420), a first narrowportion 430, and a second narrow portion 435 (opposite the length of thecentral cavity 400 from the first narrow portion 430). The contact ring40 also has a first side portion 440 (attached to the first narrowportion 430 of the raised main body 405), a second side portion 445(attached to the second narrow portion 435), and multiple fins 450, 455(attached, respectively, to side portions 440, 445). The side portions440, 445 are generally oriented perpendicular to the main body 405 andextend downward and away from the lower surface 415 of the main body405. The fins 450, 455 are generally oriented perpendicular to the sideportions 440, 445 and extend away from the side portions 440, 445 andthe main body 405.

The lower surface 415 of the main body 405 is preferably attached to thelandings 330, 335 on the upper surface 300 of the first circuit board 30by a screen applied solder paste, which is then sent through a reflowoven. This occurs, preferably, at the same time the lower surface 210 ofthe LED 20 is attached to the upper surface 300 of the first circuitboard 30. The lower surface 415 of the main body 405 is orientedrelative to the upper surface 300 of the first circuit board 30 so thatthe LED 20 is positioned within the central cavity 400. Additionally,the central cavity 400 is large enough so that the positive contact onthe lower surface 210 of the LED 20 and the positive terminal 315 on theupper surface 300 of the first circuit board 30 are electricallyisolated from the contact ring 40 by non-electrically conductingsubstrate 310.

The lower surface 415 of the main body 405 is oriented relative to theupper surface 300 of the first circuit board 30 so that the first wideportion 420 of the main body 405 is located directly above the firstwide region 345 on the upper surface 300 of the first circuit board 30,the second wide portion 425 of the main body 405 is located directlyabove the second wide region 355 on the upper surface 300 of the firstcircuit board 30, the first narrow portion 430 of the main body 405 islocated directly above the first narrow region 350 on the upper surface300 of the first circuit board 30, and the second narrow portion 435 ofthe main body 405 is located directly above the second narrow region 360on the upper surface 300 of the first circuit board 30. The first wideportion 420 is therefore in thermal and electrical communication withthe first wide region 345, the second wide portion 425 is in thermal andelectrical communication with the second wide region 355, the firstnarrow portion 430 is in thermal and electrical communication with thefirst narrow region 350, and the second narrow portion 435 is in thermaland electrical communication with the second narrow region 360.

It is to be understood, however, that the above configuration of thecontact ring 40 relative to the upper surface 300 of the first circuitboard 30 is not meant to be limiting. For example, other shapes oflandings and contact rings may also be suitably employed. The maindirective is to transfer heat from the first circuit board 30 to thecontact ring 40. In the illustrated configuration, heat is transferredfrom the wide regions 345, 355 of the first and second landings 330, 335to the wide portions 420, 425 of the main body 405. From the wideportions 420, 425 of the main body 405, heat is then transferred to thefirst and second side portions 440, 445, and then to the multiple fins450, 455 emanating outward from both side portions 440, 445.

The contact ring 40 is preferably made from a single piece of berylliumcopper, or another electrically and thermally conductive material.

FIG. 10 illustrates the lower contact 50 of the present embodiment. Thelower contact 50 has a first circuit board gripping element 500, asecond circuit board gripping element 520, a main portion 540, and aleaf spring 550. The first circuit board gripping element 500, secondcircuit board gripping element 520, main portion 540, and leaf spring550 are all in electrical communication with each other, and preferablyformed from beryllium copper sheet stock.

The first circuit board gripping element 500 comprises a first prong502, a second prong 504, and a base 506. The first and second prongs502, 504, in conjunction with the base 506, define an interstitial space508. The interstitial space 508 is open in the direction opposite thebase 506. The first and second prongs 502, 504 preferably widen,inwardly toward the interstitial space 508, as they propagate away fromthe base 506. This results in a narrowing of the interstitial space 508near the ends 510 & 512 of the prongs 502, 504. Thus, any portion of acircuit board of sufficient width inserted into the interstitial space508 can be mechanically held in place by the first and second prongs502, 504 and can be supported by the base 506. The ends 510, 512 of theprongs 502, 504 are also preferably rounded, so as to facilitate theinsertion of at least a portion of a circuit board between the first andsecond prongs 502, 504 and into the interstitial space 508.

The second circuit board gripping element 520 is identical to the firstcircuit board gripping element 500, and has a first prong 522, a secondprong 524, and a base 526. The first and second prongs 522, 524, inconjunction with the base 526, form an interstitial space 528.

The main portion 540 of the lower contact 50 is preferably substantiallycircular in shape, with upper 542 and lower 544 surfaces, and isperforated by several holes 546. These holes 546 provide flow paths whenthe lower insulator 60 is injection molded around the lower contact 50,and help mechanically lock the lower contact 50 to the lower insulator60. The first and second circuit board gripping elements 500, 520 are inphysical contact with the main portion 540 and are preferably separatedby a distance equal to half the diameter of the main portion 540. Thefirst and second circuit board gripping elements 500, 520 are orientedperpendicular to the upper surface 542, with the ends of the prongsextending away from the upper surface 542 and the interstitial spaces508, 528 in alignment with each other. In this configuration, a printedcircuit board held in place by the first and second circuit boardgripping elements 500, 520 would be oriented perpendicular to, and wouldextend away from, the upper surface 542.

The leaf spring 550 is positioned adjacent to the lower surface 544 ofthe lower contact 50. It preferably takes a convex “U” shaped form. Thefirst end 554 is connected to the main portion 540 at creases 555.Further, the leaf spring 550 is preferably formed so that the second end552 is in physical contact with the lower surface 544 when the spring isin an unbiased state, but with the remainder of the leaf spring 550spaced apart from the lower surface 544 (with the maximum separationapproximately halfway between the first and second ends 554, 552). Theleaf spring 550 is therefore capable of electrically communicating withthe anode terminal of a battery, while still providing some degree ofshock absorbance if the anode terminal is accelerated toward the leafspring 550. Alternatively, in portable lighting devices where the LEDmodule 10 is not in direct contact with the anode terminal of a battery,the leaf spring 550 of lower contact 50 helps ensure electrical contactis established and maintained with an adjacent conductive elementforming part of the main power circuit of the lighting device.

The lower contact 50 is preferably made from a single piece of berylliumcopper, or another suitable electrically conductive material.

FIGS. 11-12 illustrate the lower insulator 60 of the preferredembodiment. The lower insulator 60 is formed from a non-electrically andnon-thermally conductive material, preferably a liquid crystal polymerthat is capable of withstanding elevated temperature. The lowerinsulator 60 is preferably injection molded around the lower contact 50,forming the lower assembly 55 (comprising the lower insulator 60 and thelower contact 50).

The lower insulator has a circumferential wall 600 and a base 620, whichtogether form a central cavity 630. The central cavity 630 is open inthe direction opposite the base 620.

The outer surface 602 of the circumferential wall 600, extendingdownward from its upper edge 604, is substantially circular in shape,with a generally uniform diameter. However, at the approximate midwaypoint between the upper edge 604 and the base 620, the outer surface 602of the circumferential wall 600 gradually increases in diameter. Thisgradual increase in the diameter of the outer surface 602 of thecircumferential wall 600 continues until just prior to the base 620. Atthat point, the diameter of the outer surface 602 of the circumferentialwall 600 abruptly decreases, and remains uniform until reaching the base620, thereby forming a circumferential groove 606.

Below the circumferential groove 606 is the base 620. The base 620 isalso substantially circular in shape, with a generally uniform diameter.However, the diameter of the base 620 is greater than any portion of thecircumferential wall 600. It therefore forms a circumferential ledge 622where the top of the base 620 meets the bottom of the circumferentialgroove 606.

As best seen in FIG. 13, the lower surface 624 of the base 620 has arecessed area 626 that houses the leaf spring 550 of the lower contact50 after molding of the lower assembly 55 is completed. The leaf spring550 is positioned in the recessed area 626 so that no portion of theleaf spring 550 extends outward to or beyond the plane formed by thelower surface 624 of the base. This feature may act as an anti-polaritydevice in portable lighting devices in which the LED module 10 isintended to be directly connected to the anode of a battery. In otherwords, if a power source (such as a battery) is placed within the bodyof a lighting device with a non-anode (e.g., cathode) terminal facingthe lower surface 624 of the base, the LED lighting module 10 of thepreferred embodiment will not receive electrical energy from the powersource. However, when the power source is properly placed within thebody of a lighting device, or in other applications where the LED module10 is not intended to be in physical contact with the power source, thisfeature may also help prevent damage to the module by the matingconductive element in the event that the lighting device is dropped orotherwise receives a significant impact.

After molding of the lower assembly 55 is completed, the first andsecond circuit board gripping elements 500, 520, respectively, of thelower contact 50 protrude into the central cavity 630, as best seen inFIG. 4. It is to be understood, however, that the illustratedorientation of the first and second circuit board gripping elements 500,520 relative to the lower insulator 60 is not meant to be limiting.

The base also has support elements 640, that protrude into the centralcavity 630, and that prevent the first and second circuit board grippingelements 500, 520 from being bent to the side when the second circuitboard 70 is inserted therein.

The inner surface 608 of the circumferential wall 600, preferably, hasan irregular diameter. For example, the inner surface 608 preferably hasa first vertical groove 610 and a second vertical groove 612, locatedopposite each other. After molding of the lower assembly 85 iscompleted, these first and second vertical grooves 610, 612 are alignedwith the interstitial spaces 508, 528 of the circuit board grippingelements 500, 520. As a result, the second printed circuit board 70retained by the circuit board gripping elements 500, 520 is not onlysupported in place by the circuit board gripping elements 500, 520, butalso by the vertical grooves 610, 612. Further, by reducing the width ofthe circumferential wall 600 in the vicinity of the first and secondvertical grooves 610, 612, a larger circuit board can be inserted intothe central cavity 630 without having to increase the diameter of theouter surface 602.

The upper edge 604 of the circumferential wall 600 preferably comprisesa first pair of prongs 614 and a second pair of prongs 616 that extendupwardly in the direction away from the base. The first pair of prongs614 are generally aligned with the prongs 502, 504 of the first circuitboard gripping element 500, with one of the pair on either side of thefirst circuit board gripping element 500. The second pair of prongs 616are generally aligned with the prongs 522, 524 of the second circuitboard gripping element 520, with one of the pair on either side of thesecond circuit board gripping element 520. There are no prongs in thevicinity of the vertical grooves 610, 612. As described in more detailbelow, the prongs assist in the alignment of the lower insulator 60 andthe upper assembly 85 during assembly of the LED module 10, therebypreventing (or at least minimizing) the twisting of the second printedcircuit board 70.

The second circuit board 70 of the preferred embodiment is nowdescribed. As seen in FIG. 14, the second circuit board 70 is generallyrectangular in shape. It has a first side 700, a second side 710, anupper edge 720, a lower edge 730, a first side edge 740, and a secondside edge 750. The second circuit board 70 is preferably ½″ in lengthalong the first and second side edges 740, 750, ⅜″ in width along theupper and lower edges 720, 730, and less than 1/16″ in thickness. Thesecond circuit board 70 acts as the LED driver board and is configuredto regulate the current delivered to the LED 20, preferably based on thetemperature of the LED 20. It can also serve additional functions, suchas an electronic switch. Energy regulating circuits that can beincorporated on the second circuit board 70, and that are capable ofregulating the energy delivered to the LED 20 based on the sensedtemperature of the LED 20, are described in United States PatentPublication 2007/0058366 A1 (published Mar. 15, 2007), which descriptionis hereby incorporated by reference.

The second circuit board 70 has a first lower contact pad 702 and asecond lower contact pad 704. The lower contact pads 702, 704 aregenerally rectangular in shape and are located on the first side 700 ofthe second circuit board 70. Largely identical first and second lowercontact pads 712, 714 are also located on the second side 710 of thesecond circuit board 70. The first and second pairs of lower contactpads 702, 712 and 704, 714 are positioned near the lower edge 730 of thesecond circuit board 70 at approximately equal distances from the sideedges 740, 750.

The second circuit board 70 can be connected to the lower contact 50 byinserting the lower edge 730 of the second circuit board 70 into thecentral cavity 630 of the lower insulator 60 so that one of the sideedges 740, 750 of the second circuit board 70 mates with one of thevertical grooves 610, 612 in the lower insulator 60, while the otherside edge mates with the other vertical groove. Upon full insertion, onepair of the lower contact pads 702, 712 and 704, 714 will be engaged bythe prongs of one of the circuit board gripping elements 500, 520 of thelower contact 50, while the other pair of lower contact pads willeventually be engaged by the prongs of the other circuit board grippingelement of the lower contact 50. At that point, the lower contact pads702, 712 and 704, 714 are in physical contact and electricalcommunication with the lower contact 50. Further, the lower circuitboard gripping elements 500, 520 grip the second circuit board throughan interference type contact.

The assembly process is simplified because the lower contact pads702,712 and 704,714 are, preferably, substantially larger than the widthof the first and second circuit board gripping elements 500, 520 of thelower contact 50. Manufacturing tolerances, therefore, need not be asstringent. Further, as the lower contact pads are a mirror image of oneanother, the second circuit board 70 may be inserted in either of thetwo possible orientations in which lower contact pads 702,712 and704,714 of second circuit board 70 are inserted first into the lowerinsulator 60.

The physical connection between the second circuit board 70 and thelower contact 50 also has increased stability. In particular, the firstand second circuit board gripping elements 500, 520 of the lower contact50 are spaced apart from each other, on opposite sides of the secondcircuit board's 70 longitudinal centerline. Stability is also increasedby the interaction between the side edges 740, 750 of the second circuitboard 70 and the vertical grooves 610, 612 of the lower insulator 60.

The electrical connection between the second circuit board 70 and thelower contact 50 also has increased reliability because of theredundancy provided. In particular, the LED module 10 is still capableof functioning even if the electrical connection at the first circuitboard gripping element 500 or the second circuit board gripping element520 is interrupted.

The second circuit board 70 also has a first upper contact pad 706 and asecond upper contact pad 708. The upper contact pads 706, 708 aregenerally rectangular in shape and are located on the first side 700 ofthe second circuit board 70. Largely identical first and second uppercontact pads 716, 718 are also located on the second side 710 of thesecond circuit board 70. The first and second pairs of upper contactpads 706, 716 and 708, 718 are positioned near the upper edge 720 of thesecond circuit board 70, one in the vicinity of the first side edge 740and one in the vicinity of the second side edge 750. Both are positionedapproximately equal distance from their respective side edges tomaintain the mirror image and redundancy features of the second circuitboard 70.

The second circuit board 70 also has a third upper contact pad 709located on its first side 700 and a largely identical third uppercontact pad 719 located on its second side. The pair of third uppercontact pads 709, 719 are positioned near the upper edge 720 of thesecond circuit board 70 approximately halfway between the side edges740, 750. While also generally rectangular in shape, the third pair ofupper contact pads 709, 719 are, preferably, larger than the first andsecond pairs of lower contact pads 702, 712 and 704, 714 and the firstand second pairs of upper contact pads 706, 716 and 708, 718.

The upper and lower pairs of contact pads are preferably plated withgold, or another electrically conductive and corrosion resistantmaterial.

The upper assembly 85 of the preferred embodiment (comprising the upperinsulator 80 and the upper contacts 90, 91) is now described. As shownin FIGS. 16-18, the upper insulator 80 of the preferred embodiment isformed from a non-electrically and non-thermally conductive material,preferably a liquid crystal polymer that is capable of withstandingelevated temperature. The upper contacts 90, 91 are preferably made fromberyllium copper, or another electrically conductive material. The upperinsulator 80 is preferably injection molded around the upper contacts90, 91, forming the upper assembly 85.

The upper assembly 85 has an upper surface 800 and a lower side 810. Theupper surface 800 is generally oval in shape with a generally flatsurface. A pair of ground upper contacts 90 are exposed on the uppersurface 800 of the upper assembly 85, with one upper contact 90 beingdisposed approximately midway between the periphery and the transversecenterline of the upper insulator 80 (on one side of the transversecenterline) and the other upper contact 90 being disposed approximatelymidway between the periphery and the transverse centerline of the upperinsulator 80 (on the opposite side of the transverse centerline). Apositive upper contact 91 is preferably exposed on upper surface 800along the transverse centerline of the upper insulator 80. None of theupper contacts 90, 91 are in physical contact with each other.

The positive and negative terminals 370, 375, 380 on the lower surface305 of the first circuit board 30 are attached to the exposed portion ofthe upper contacts 90, 91 by a screen applied solder paste, which isthen sent through a reflow oven. This preferably occurs after the lowersurface 210 of the LED 20 and the lower surface 415 of the contact ring40 have been attached to the upper surface 300 of the first circuitboard 30.

The lower surface 305 of the first circuit board 30 is oriented relativeto the upper contacts 90, 91 so that the positive terminal 370 on thelower surface 305 of the first circuit board 30 is located above, and inalignment with, the exposed portion of upper contact 91, the firstnegative terminal 375 on the lower surface 305 of the first circuitboard 30 is located above the exposed portion of one of the pair ofupper ground contacts 90, and the second negative terminal 380 on thelower surface 305 of the first circuit board 30 is located above theexposed portion of the other upper ground contact 90 exposed on theupper surface 800 of the upper assembly 85. The positive terminal 370 istherefore in electrical communication with the upper contact 90, thefirst negative terminal 375 is in electrical communication with oneupper contact 90, and the second negative terminal 380 is in electricalcommunication with the other contact 90. The foregoing configurationpermits the first circuit board 30 to be oriented relative to the uppersurface 800 in either of two possible orientations.

The orientation of the first circuit board 30 relative to the uppercontacts 90, 91 in one of two possible orientations is aided by twoalignment pegs 820 that extend away from the upper surface 800 of theupper insulator 80. These pegs 820 engage the corresponding alignmentholes 399 in the first circuit board 30.

The electrical connection between the first circuit board 30 and theupper contacts 90 also has increased reliability because of theredundancy provided. In particular, the module 10 is still capable offunctioning if either of the upper ground contacts 90 are interrupted.

The upper surface 800 of the upper assembly 85 is more oval shaped andsomewhat larger than the lower surface 305 of the first circuit board30. As a result, those portions of the upper surface 800 of the upperassembly 85 that are not covered by the lower surface 305 of the firstcircuit board 30 are covered by the fins 450, 455 that emanate outwardfrom the side portions 440, 445 of the contact ring 40.

Upper ground contacts 90 have a main portion 902, which is embedded inthe upper insulator 80 and exposed on the upper surface 800, and acircuit board gripping element 904 for gripping the second circuit board70 similar to those described in connection with the lower contact 50.The upper contact 91 has a main portion 922, which is embedded in theupper insulator 80 and exposed on the upper surface 800, and a pair ofcircuit board gripping elements 924 similar to those described inconnection with the lower contact 50.

After molding of the upper assembly 85 is completed, the circuit boardgripping elements 904 of the upper contacts 90 protrude below the lowerside 810 of the upper insulator 80 generally below the main portions 902of the upper contacts 90. Similarly, the circuit board gripping elements924 protrude below the lower side 810 of the upper insulator 80generally below the main portion 922 of the upper contact 91.

The upper assembly 85 also has support elements 830 that protrude belowthe lower side 810 of the upper insulator 80 and that are configured toprevent the circuit board gripping elements 904, 924 from being bentupon insertion of the second circuit board 70.

Upon assembly of the module 10, the first pair of upper contact pads706, 716 of the second circuit board 70 are engaged by the prongs ofcircuit board gripping element 904 of one of the upper contacts 90,while the second pair of upper contact pads 708, 718 of the secondcircuit board 70 are engaged by the prongs of the circuit board grippingelement 904 of the other upper contact 90. Similarly, the third pair ofupper contact pads 709, 719 of the second circuit board 70 are engagedby the prongs of the pair of circuit board gripping elements 924 ofupper contact 91. The first pair of upper contact pads 706, 716 aretherefore in electrical communication with one of the upper contacts 90,the second pair of upper contact pads 708, 718 are in electricalcommunication with the other upper contact 90, and the third pair ofupper contact pads 709, 719 are in electrical communication with theupper contact 91 via the pair of circuit board gripping elements 924.

The assembly process is simplified because the upper contact pads 706,716, 708, 718 and 709, 719 are, preferably, substantially larger thanthe width of the respective circuit board gripping elements 904, 924 ofthe upper contacts 90, 91. Manufacturing tolerances, therefore, need notbe as stringent. Further, the above configuration also permits the upperassembly 85 to be installed on the second circuit board 70 in either ofthe two possible orientations.

The physical connection between the second circuit board 70 and theupper contacts 90, 91 also has increased stability. In particular,circuit board gripping elements 904 of the upper contacts 90 are spacedapart from each other, on opposite sides of the longitudinal centerlineof the second circuit board 70. Stability is also increased by thecircuit board gripping elements 924 that engage the third pair of uppercontacts 709, 719.

The electrical connection between the second circuit board 70 and theupper contacts 90, 91 also has increased reliability because of theredundancy provided by the pair of circuit board gripping elements 904and the pair of circuit board gripping elements 924. In particular, theLED module 10 is still capable of functioning if the connection at oneof the circuit board gripping elements 904 or one of the circuit boardgripping elements 924 is interrupted.

As best seen in FIG. 4, the two pairs of prongs 614, 616 that protrudefrom the upper edge 604 of the lower insulator 50 aid in the alignmentof the upper assembly 85 relative to the lower assembly 55 and thesecond circuit board 70. The prongs 614, 616 also prevent movement ofthe lower assembly 55 relative to the upper assembly 85, therebypreventing twisting of the second circuit board 70.

A heat sink 101 of the present embodiment comprises contact ring 40 andouter housing 100, preferably made of metal. Outer housing 100 of thepresent embodiment is generally cylindrical in shape and has acircumferential wall 110 with an upper lip 112 and a lower edge 114. Theupper lip 112 defines a generally circular upper opening 116 and thelower edge 114 defines a generally circular lower opening 118. Withinthe circumferential wall is a central cavity.

The circumferential wall 110 is generally circular in shape with auniform thickness. The diameter of the circumferential wall 110, at anypoint from the upper lip 112 to lower edge 114, is only slightly largerthan the corresponding diameter of the outer surface 602 of thecircumferential wall 600 of the lower insulator 60. However, there is nocorresponding circumferential groove 606.

The LED 20, the first circuit board 30, the contact ring 40, the lowerinsulator 60 (with lower contact 50), and the upper insulator 80 (withupper contacts 90, 91) can therefore be inserted into the central cavityof the heat sink 100 via the lower opening 118. Upon full insertion, theLED 20 and a portion of the contact ring 40 are exposed through theupper opening 116. In this position, the lower edge 114 of thecircumferential wall 110 is supported by the circumferential ledge 622of the lower insulator 60. The outer housing 100 is then secured in thisposition to the lower insulator 60 by inwardly crimping thecircumferential wall 110 of the outer housing 100 where it overlays thecircumferential groove 606 in the lower insulator 60.

Upon assembly, the outer housing 100 is in physical, electrical, andthermal communication with the contact ring 40. In particular, the upperlip 112 is in physical contact with, at least, the multiple fins 450,455 of the contact ring 40. This physical, electrical, and thermalcommunication may be improved by injecting solder paste into two accessnotches 120 in the upper lip 112, on opposite sides of the upper opening116, located directly above the multiple fins 450, 455 of the contactring 40 and then running the entire LED module 10 through a reflow oven.However, a lower temperature solder composition (e.g., a soldercomposition with a lower solidus temperature and/or a lower liquidustemperature) is preferably used so that_the temperature of the reflowoven may be preferably lower than the oven used to attach the LED 20,and preferably below the solidus temperature of the solder compositionused to solder the contact ring 40 and the upper contacts 90, 91 to thefirst circuit board 30.

The outer housing 100 is made from an electrically and thermallyconductive material, preferably nickel plated aluminum.

LED modules according to the present invention may be used in a varietyof lighting devices, including portable lighting devices such asflashlights and headlamps. As shown in FIGS. 19-20, for example, the LEDmodule 10 may be positioned so that an anode terminal 14 of a powersource 16 (e.g., one or more batteries) of a flashlight 12 is inelectrical communication with the leaf spring 550 of the lower contact50, and the outer housing 100 is in electrical communication with thecathode terminal 28 of the power source 16. Although FIGS. 19-20 showthe anode terminal 14 in electrical communication with the leaf spring550 through an electrically conductive pathway that includes severalstructures, the module 10 can be alternatively positioned so that theanode terminal 14 is in electrical communication with the leaf spring550 through any other electrically conductive pathway, including directphysical contact. Similarly, although FIGS. 19-20 show the outer housing100 in electrical communication with the cathode terminal 28 through anelectrically conductive pathway that includes several structures(including the barrel 18), the module 10 can be alternatively positionedso that the outer housing 100 is in electrical communication with thecathode terminal 28 through any other electrically conductive pathway,including direct physical contact with the barrel 18. The LED 20 ispositioned within the reflector 32 of the flashlight to project lightthrough the lens 22.

It to be expressly understood that the present invention is notrestricted to the flashlight 12 described herein. Further, as willbecome apparent to those skilled in the art after reviewing the presentdisclosure, one or more aspects of the LED module 10 may also beincorporated into other portable lighting devices, including, forexample, headlamps.

The flow of thermal energy away from the LED 20 in the preferredembodiment will now be described. Heat generated by the LED diode 220 istransferred through the heat pad on the lower surface 210 of the LED 20to the thermal pad 325 on the upper surface 300 of the first circuitboard 30. Heat is then transferred from the thermal pad 325, through themultiple parallel high copper content layers 385-388 and thermal vias390, 395 of the first circuit board 30, and into the main body 405 ofthe contact ring 40. The heat is then transferred from the main body 405of the contact ring 40, through its side portions 440, 445, and into itsfins 450, 455. From the fins 450, 455, heat is then transferred into theouter housing 100. However, heat is also transferred directly from themain body 405 of the contact ring 40 to the outer housing 100 of theheat sink 101 via the solder joints formed in the vicinity of the twoaccess notches 120. One option is to then transfer the heat from theouter housing 100 into the barrel 18 of a flashlight 12 or other largethermally conductive body of the lighting device.

The flow of energy through a flashlight 12 equipped with the LED module10 will now be described. Electrical energy is produced in one or morebatteries 16. From the anode terminal 14 of the foremost battery,electricity flows (through an electrically conductive pathway that caninclude snap in contact 34, L-shaped contact 36, assembled circuit board38, L-shaped contact 42, inner contact sleeve 44, spring 46, outercontact sleeve 48, and compact disc 52) into the LED module 10 throughthe leaf spring 550 of the lower contact 50. Electricity then flows outof the lower contact 50 and into the second circuit board 70 through theelectrical connection formed between the circuit board gripping elements500, 520 of the lower contact 50 and the first and second pairs of lowercontact pads 702, 712 and 704, 714 near the lower edge 730 of the secondcircuit board 70. Electrical energy then flows out of the second circuitboard 70 and into the upper contact 91 through the electrical connectionformed between the third pair of upper contact pads 709, 719 near theupper edge 720 of the second circuit board 70 and the pair of circuitboard gripping elements 924 of the upper contact 91. Electrical energythen flows out of the main portion 922 of the upper contact 91 and intothe first circuit board 30 through the positive terminal 370 on itslower surface 305. Electrical energy then flows through the firstcircuit board 30 using electrical via 397 and enters the LED diode 220through the solder bond between positive terminal 315 and the positivecontact on the lower surface 210 of the LED 20, where electrical energythen flows through the diode 220, to produce light.

From the LED diode 220, electrical energy exits the LED 20 and flowsback into the upper circuit board 30 through the solder bond between thenegative contact on the lower surface 210 of the LED 20 and negativeterminal 320 of the first circuit board 30. Electrical energy then flowsfrom the first circuit board 30 into the contact ring 50 through thesolder joint formed between the first and second landings 300, 335 onthe upper surface 300 of the first circuit board 30 and the first andsecond wide portions 420, 425 of the main body 405 of the contact ring40 portion of the heat sink 101. Electrical energy then flows from thecontact ring 40 to the outer housing 100 of the heat sink 101, and thento the barrel 18 (through an electrically conductive pathway that caninclude ball 22, ball housing 54, ground contact 58, and set screw 62)or other source of electrical connection of the flashlight 12. From thebarrel 18, or through another electrical connection, electrical energyflows into the tail cap 24, through the tail cap spring 26, and into thecathode terminal 28 of the rearmost battery, thereby completing thecircuit.

Additionally, the first circuit board 30 provides a ground for thesecond circuit board 70. The ground connection runs from negativeterminal 320 on the upper surface 300 of the first circuit board 30,through electrical vias 398, to negative terminals 375, 380 on the lowersurface of first circuit board 30. The negative terminals 375, 380 are,in turn, in electrical communication with upper contacts 90 which are,in turn, in electrical communication with the second circuit board 70through the electrical connection formed between the two circuit boardgripping elements 904 and first and second pairs of upper contact pads706, 716 and 708, 718.

While a preferred embodiment of an improved LED module and itsrespective components have been presented in the foregoing disclosure,numerous modifications, alterations, alternate embodiments, andalternate materials may be contemplated by those skilled in the art andmay be utilized in accomplishing the various aspects of the presentinvention. Thus, it is to be clearly understood that this description ismade only by way of example and not as a limitation on the scope of theinvention as claimed below. Moreover, while directional terms such asupper and lower have been used to facilitate the description of thepreferred embodiment, the relative orientation of the components of thepreferred embodiment are not meant to be so limited.

What is claimed is:
 1. A lighting module, comprising: a circuit board; alight emitting diode attached to said circuit board with solder; and aheat sink attached to said circuit board with solder; wherein said heatsink comprises an outer housing.
 2. The lighting module of claim 1,wherein said circuit board has a plurality of thermally conductivelayers.
 3. The lighting module of claim 2, wherein two or more of saidplurality of thermally conductive layers are connected by vias.
 4. Thelighting module of claim 3, wherein one or more of said vias are blindvias.
 5. The lighting module of claim 1, wherein said heat sink is inthermal and electrical communication with said light emitting diodethrough said circuit board.
 6. The lighting module of claim 1, whereinsaid lighting module further comprises a second circuit board, and saidsecond circuit board is in electrical communication with said circuitboard.
 7. The lighting module of claim 6, wherein said second circuitboard controls said light emitting diode.
 8. The lighting module ofclaim 7, wherein said second circuit board serves as an electronicswitch for said light emitting diode.
 9. The lighting module of claim 6,wherein said second circuit board is in electrical communication withsaid circuit board through a plurality of electrical connectors.
 10. Thelighting module of claim 9, wherein two or more of said plurality ofelectrical conductors are equally spaced relative to the longitudinalcenterline of said second circuit board.
 11. The lighting module ofclaim 6, wherein said second circuit board is capable of maintainingelectrical communication with said circuit board in a plurality oforientations relative to said circuit board.
 12. The lighting module ofclaim 6, wherein said lighting module further comprises a contact, andsaid contact is in electrical communication with said second circuitboard.
 13. The lighting module of claim 12, wherein said contact is inelectrical communication with said second circuit board through aplurality of electrical connectors.
 14. The lighting module of claim 13,wherein two or more of said plurality of electrical conductors areequally spaced relative to the longitudinal centerline of said secondcircuit board.
 15. A lighting module, comprising: a thermally conductivecircuit board; a light emitting diode attached to said thermallyconductive circuit board with a first solder composition; and a heatsink, comprising a thermally conductive member and an outer housing,attached to said thermally conductive circuit board with a second soldercomposition; wherein said thermally conductive member is attached tosaid outer housing with a third solder composition, said third soldercomposition having a liquidous temperature lower than the liquidoustemperature of said first and said second solder compositions.
 16. Thelighting module of claim 15, wherein said first solder composition andsaid second solder composition are identical.
 17. The lighting module ofclaim 16, wherein said light emitting diode is in electricalcommunication with said heat sink.
 18. A lighting device, comprising: abody; and a lighting module, housed within the body, comprising a lightemitting diode, a circuit board, and a heat sink; wherein said lightemitting diode is attached to said circuit board with solder; whereinsaid heat sink is attached to said circuit board with solder; andwherein said heat sink is in electrical communication with said body andsaid light emitting diode.
 19. The lighting device of claim 18, whereinsaid body houses a power source having an anode contact and a cathodecontact, wherein said lighting module further comprises a contact inelectrical communication with said circuit board, and wherein saidlighting module is configured to prevent electrical communicationbetween said cathode contact of said power source and said contact ofsaid lighting module, while allowing electrical communication betweensaid anode contact of said power source and said contact of saidlighting module.
 20. The lighting device of claim 19, wherein saidcontact of said lighting module is a leaf spring.